MediaTek, a leading global fabless semiconductor company, has announced its latest flagship chipset, the Dimensity 9300, which aims to deliver the ultimate performance and user experience for smartphone enthusiasts. The Dimensity 9300 is the first mobile platform to feature an all-big core CPU design, a ray-tracing GPU, and a generative AI engine, among other innovations.
The Dimensity 9300 is built on TSMC’s third-generation 4nm+ process node, which offers improved power efficiency and thermal management. The chipset boasts an octa-core CPU configuration, consisting of four Cortex-X4 prime cores and four Cortex-A720 efficiency cores, all based on the Armv9 architecture. The Cortex-X4 is the most powerful CPU core from Arm, offering up to 15% higher single-core performance and 40% higher multi-core performance than the previous generation Cortex-X3. The Cortex-A720 is a new core that balances performance and power efficiency, delivering up to 33% lower power consumption than the Cortex-A715. The Dimensity 9300 is the world’s first flagship smartphone chip to use all big cores, providing enthusiasts with the ultimate computing power.
The CPU is paired with a 12-core Immortalis-G720 MC13 GPU, which supports hardware-based ray tracing, a technique that simulates realistic lighting and shadows in 3D graphics. The Immortalis-G720 offers a 46% improvement in peak performance, 40% power savings, and 40% memory bandwidth savings in geometry-heavy game scenes compared to the previous generation Immortalis-G715. The Dimensity 9300 is the world’s first mobile platform to achieve console-level global illumination effects with ray tracing, enabling gamers to enjoy immersive and realistic gaming experiences at a smooth 60 FPS.
The Dimensity 9300 also features a next-generation APU architecture, which incorporates a hardware generative AI engine, enabling faster and safer edge AI computing. The generative AI engine can create new content from existing data, such as text, images, music, and more, using transformer-based models. The Dimensity 9300 supports up to 33 billion parameters, the largest model size for on-device AI, and can generate content in less than one second, thanks to the exclusive hardware-accelerated memory compression technology. The generative AI engine also supports LoRA Fusion, a novel technique that fuses multiple modalities of data, such as text and image, to create richer and more diverse content.
The Dimensity 9300 supports screens with up to WQHD resolution and 180Hz refresh rate, as well as dual-active displays for foldable devices. The chipset also supports the latest LPDDR5T RAM at 9,600Mbps speeds and UFS 4.0 storage with Multi-Circular Queue (MCQ) support, which improves the performance and reliability of flash memory. The chipset also features an Imagiq 990 ISP, which supports up to 320MP cameras, always-on HDR, and a standalone image stabilization module. The ISP can capture up to 8K video at 30 fps or 4K video at 60 fps with cinematic mode and real-time bokeh.
The Dimensity 9300 also comes with a R16 5G modem, which supports both sub-6GHz and mmWave bands, with up to 7.9Gbps peak download speed. The modem also features MediaTek UltraSave 3.0+ technology, which optimizes the power consumption of the 5G connection based on the network conditions and user behavior. The chipset also supports Wi-Fi 7, Bluetooth 5.4, and GNSS technologies, providing fast and reliable connectivity for users.
The Dimensity 9300 is expected to power the upcoming vivo X100 series. MediaTek claims that the Dimensity 9300 will offer a superior performance and user experience compared to the Qualcomm Snapdragon 8 Gen 3, which is the main competitor of the chipset. MediaTek also says that the Dimensity 9300 will be available for other smartphone makers in the coming days.